Physical Parameters
Maximum design floors
78th floor
Maximum number of PINs
150000+
maximum connection
120+
Minimum lineweight
35um
Minimum line spacing
35um
Minimum via
60um laser hole
Maximum number of BGAs
120+
Minimum BGA PIN spacing
0.15mm
Maximum BGA PINs
18865
Highest speed signal
224G-PAM4
Involved in Lamination Scheme
processor
PHYTIUM： FT-5000/2500/ 2000/ 1500 Series D3000
ShenWei： ShenWei 3232/3231/1621/1631/421
LOONGSON： LOONGSON1/LOONGSON2 /LOONGSON3 Series
Rockchip： Rk35/33/32/31/30/18 Series
HISILICON： Hi31/ Hi35/ Hi37 Series
Cambricon： C10 MLU 220 /290/370
ZhaoXin： KX-5000/6000/7000
HYGON： Hygon-5000/7000
Intel： Purley Ivy Bridge and Sandy Bridge Series Whitley Eagle Stream Shark Bay MobilePlatform Birch_Stream Coffeelake-H Ice Lake Comet LakeTiger Lake E810 Alder Lake Raptor Lake Arrow Lake Lunar Lake
AMD： Fp3 Fp5 Fp6 Fp7 Fp8 Sp3 Sp5
Marvell： PXA920/920H Series/3XX/27X Xelerated Series ARMADA1000/1500 98CX8129/8297
Qualcomm/SPRD/MTK Mobile： MSM86XX / 82XX / 76XX SC9610 / 8810 / 6820/8380XP MT6573 / 6575 / 6577/ 6589
Freescale PowerPC Series： MPC8541 / 8548 / 8555 / 8641 P2020
TI： AM35X / 38X / 335X / 437X / 5K2EX / P3505 OMAP4430 66AK2EX / AK2HX C667X
FPGA/CPLD
AMD Xilinx： Spartan-6 Spartan-7 FPGA Artix-7 Kintex-7 Virtex-7 Virtex5 Zynq-7 Virtex-ultrascale XCVU7P/XCVU9P/XCVU11P/ XCVU13P/XCVU15P/XCVU19P Versal AMD Versal Series
Intel/Altera：Stratix Series （S10） Arria Series ( A10 ) Cyclone series MAX Series 1SG280 Nf43
Cavium: CN106XXX CN9XXX CN8XXX CN7XXX CN6XXX CN50XX NITROX III NITROX PX
Lattice： MachX03 Series MachX02 Series LatticeECP3 Series iCE40 Series
Power module and chip
TI： TPS62XXX/65XXX TPS75XXX/82XXX TPS54XXX/40XXX LM51XXX/50XXX PTH0XXX BQ25XXX/24XXX
Linear： LTM46XX/80XX
Maxim: MAX8698/8903A
Intel： EM2140P01QI EM2260xQI EM2280xQI
Renesas： ISL91302B ISL91301A ISL91301B ISL99140 ISL99227
MPS： MPM26XX/35XX MPM36XX/38XX MPM54XX MEZD41XXX MPQ86XXX
Infineon： TDA21XXX TDA38XXX TDM22545D TLF12505
Conversion interface chip
Broadcom： BCM78900 BCM56334/56331/56960/56980/56990 BCM84793/8129/88370/88470……
ADI： AD5767/4001/9776/9779 AD9788/8370/8012 ADE9000 ADAQ7980/7988
TI： ADS8860/8861/54J60 ADC32RF45/3244/8775 ADC39J84/80004 DAC5681/DAC3282
Marvell： 88E6083/1111/8070/8059 88DE2750
PMC： PM5440/5990/80XX
ClariPhy： Cl20010
Nephos： Np8579/NP8369/NPS400
Memory chip
Samsung：DDR5 DDR4 DDR3 GDDR5/6/7 LPDDR4/4X LPDDR5/5X
Hynix：DDR5 DDR4 DDR3 DDR2 GDDR5/6/7 LPDDR4/4X LPDDR5/5X
Mircon： DDR5 DDR4 DDR3 GDDR5/6/7 LPDDR4/4X LPDDR5/5X
CXMT： DDR5 DDR4 DDR3 LPDDR4/4X LPDDR5Design Process
Quality Assurance
Self-Inspection
We follow hundreds of check lists involving layout, wiring, high-speed, thermal design, structure, etc.
Strict quality systems and self-inspection mechanisms
Mutual Inspection
Strict mutual inspection system
Perfect DFM inspection process
Review
Our team of senior engineers participate in the final review
Comprehensively check the principal design, DFM, DFT, SI, PI, EMC, etc.
Areas Involved
Communications Equipment
Switch, Router, Various 4G/5G office/terminal equipment, Backbone and Access network transmission equipment, Optical network, etc
Medical Devices
Ultrasound, Nuclear magnetic resonance equipment, CT, IVD in vitro diagnosis, Infrared temperature measurement, Blood coagulation detection, Digital X-ray imaging and other detection
Computer Electronics
Servers, Notebooks, Network storage,Tablets, Hyperbooks, Cloud computing, etc
Industrial Control Systems
Artificial intelligence, Machine vision, Intelligent manufacturing equipment, Smart grid, Distribution network equipment, Clean energy equipment, Engineering machinery, Agricultural machinery, Fire fighting equipment and other industrial automation equipment
Semiconductor
Integrated circuit, Consumer electronics, Communication system, Photovoltaic power generation, Lighting, High-power power conversion and other chips
Rail Transportation
Rail transit vehicles and various electrome chanical equipment, Rail transit autonomous operation system, Train dispatching command system, etc
Consumer Electronics
Smart phones,PDAs,Digitalcameras,E-books,GPS,Wearable devices, VR,Intelligent Internet of Things,etc
New energy vehicles
Dynamic system,Chassis System,Auto drive system,Automobileintelligent system,Electronics system