板厂-手机端

PCB Manufacturing

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Located in the heart of South China's PCB industry cluster, EDADOC Zhuhai PCB Factory benefits from a highly skilled workforce and a well-established supply chain. Phase 1 is fully operational, specializing in high-end quick-turn PCBs, including high-layer count, high-precision, and HDI PCB manufacturing. Phase 2 focuses on high-volume production of high-speed, multi-layer PCBs, addressing the growing demand in China’s high-end quick-turn market. Committed to driving technological advancements in the domestic PCB industry, we excel in rapid delivery of high-speed, high-layer-count, and complex PCB products. Our industry-leading capabilities enable 12-20 layer PCB fabrication in as fast as 8 days, setting a new benchmark in speed and quality.


Our PCBs are widely used in ATE, AI computing, optical modules, servers, industrial control, telecommunications, automotive, and medical equipment.

Board Making Advantages

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PCB of high-end, quick turnaround and mass production

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High-end and batch PCB production for 2-120 layers

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8-day turnaround for boards with 20 layers or fewer

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Core team with over 20 years of industry management experience

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Minimum line width and line space: 30/30um

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Max. aspect ratio: 50:1

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Long-term inventory of conventional FR4 and high-speed materials

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Newly imported advanced equipment and Thousand-Level Clean Room

Technical Capabilities

Process Parameters

Project Process parameters
Layer 2-120 L
Board Thickness 0.3-10mm
Maximum size 610*1200mm
Mechanical hole aperture ≥0.13mm
Laser hole aperture 0.06mm
HDI type 1+n+1, 2+n+2, 3+n+3, any order HDI
Aspect ratio 50:1
Interlayer alignment (High Layer Count) 4mil
Minimum line width and line space 30/30um
Impedance tolerance ±5%
Back drilling STUB tolerance 2-6mil
Routing tolerance ±0.05mm
Bow and twist ≤0.5%
Copper Clad Laminate (CCL) Conventional FR4, M4/M6/M7/M8, IT958, IT968, IT988GSE, S7439C, TU883, TU933, TU862HF, RT5880, RO4350, etc
Surface treatment HASL,lead-free HASL(LF-HASL),Immersion gold,Immersion tin,Immersion silver,Gold plating,Electroless Nickel/Electroless,OSP,Immersion gold+OSP
Special process Stepped hole,Metal base PCB,Embedded resistor and capacitor,Mixed - laminate,Rigid-flex printed circuit board,Back drilling,Gold fingers,POFV,Partial gold - plating

Production Cycle

Number of layers Batch Template Urgent
2L 9days 5days 48h
4L 10days 6days 3days
6L 11days 6days 3days
8L 11days 7days 4days
10L 12days 7days 4days
12L 12days 8days 5days
14L 12days 8days 5days
16L 12days 8days 5days
18L 12days 8days 6days
20L 12days 8days 6days
22L 16days 12days 8days
24L 16days 12days 8days
26L 16days 12days 8days
28L 16days 12days 8days
30L 16days 12days 8days
32L 18days 14days 10days
34L 18days 14days 10days
36L 18days 14days 10days

Note: Please contact our staff for the specific delivery time.

PCB Factory Equipment

Orbotech LDI High-precision Exposure Machine

Orbotech LDI High-precision Exposure Machine

Vacuum Twin Fluid Etching Line

Vacuum Twin Fluid Etching Line

Germany Lauffer Vacuum high temperature pressing machine

Germany Lauffer Vacuum high temperature pressing machine

Germany Schmoll CCD Drilling Machine

Germany Schmoll CCD Drilling Machine

CCD Electromagnetic Bonding Machine

CCD Electromagnetic Bonding Machine

Mitsubishi Laser Drilling Machine

Mitsubishi Laser Drilling Machine

X-Ray Target Drilling machine

X-Ray Target Drilling machine

ORC Solder Mask Exposure Machine

ORC Solder Mask Exposure Machine

Sixteen-Axis Ceramic Grinding Machine

Sixteen-Axis Ceramic Grinding Machine

Orbotech AOI

Orbotech AOI

Germany ATG Flying Probe Testing machine

Germany ATG Flying Probe Testing machine

AVI

AVI

Product Display

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ENIG board

·Number of layers: 10

·Board material: FR4

·Board thickness: 1.8mm

·Surface finish: ENIG

·Soldermask: Blue


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Data communication board

·Number of layers: 18

·Board thickness: 2.4mm

·Surface finish: ENIG

·Minimum line width/ line distance: 3/3mil

·Soldermask: Green


hdi

HDI board

·HDI type: 3 + 4 + 3

·Surface finish: ENIG

·Minimum line width/ line distance: 2.4/2.4mil

·Minimum medium thickness: 2.2mil

·Soldermask: Green


BB

Backboard

·Number of layers: 28

·Board material: HI-TG FR4 

·Board thickness: 5.0mm

·Surface finish: ENIG

·Soldermask: Green


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Radio-frequency board

·Number of layers: 8 

·Board material: FR4, Rogers Ro4003 

·Board thickness: 1.6mm 

·Surface finish: ENIG

·Soldermask: Green


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HDI board

·Number of layers: 10

·Board thickness: 1.2mm

·Surface finish: ENIG

·Minimum line width/ line space: 2.4/2.4mil

·HDI type: 1+4+1


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Flex-rigid board

·Number of layers: 12 

·Board thickness: 1.6mm 

·Surface finish: ENIG + selective tin spraying 

·Minimum line width/ line space: 4/4mil 

·Other process: Blind and buried vias, blue glue