EMC Made Simple - Printed Circuit Board and System Design

Source:Edadoc Time:2016/4/21

Edadoc EMC tutorial will be held at May 16th - 17th
Topic: EMC Made Simple - Printed Circuit Board and System Design
Address: City Inn, OCT, Shenzhen, China

About the Instructor  
Mark Montrose is principle consultant of Montrose Compliance Services, Inc., a full service regulatory compliance firm specializing in electromagnetic compatibility (EMC) and industrial product safety. He has over thirty five years of experience as a trainer, consultant, systems designer, product engineer, manufacturing engineer and component engineer in addition to management positions in both Regulatory Compliance and Engineering Services.  Work experience includes design, test and certification of Information Technology, along with Industrial, Scientific and Medical Equipment, specializing in the international arena for the European EMC Directive.
Mark is a Senior Member of the IEEE and a past member of the Board of Directors of the IEEE as a Division Director (2009-2010).  He is also a long-term member of the IEEE EMC Society Board of Directors plus Champion and First President of the IEEE Product Safety Engineering Society.  Mark is considered a world-class expert in applied printed circuit board and system design for EMC compliance.  He has presented numerous papers based on sophisticated research at International EMC Symposiums and Colloquiums worldwide.  Mark also provides low-cost, professional and personalized in-house training and consulting services worldwide in addition to being an instructor for the University of California, Santa Cruz extension program.
Mark has authored the following best-selling text/reference books:
    • Printed Circuit Board Design Techniques for EMC Compliance. 1996-1st edition / 2000-2nd edition
    • EMC and the Printed Circuit Board - Design, Theory and Layout Made Simple. 1999.
    • Testing for EMC Compliance – Approaches and Techniques. 2004.
    • EMC Made Simple – Printed Circuit Board and System Design. 2014
    • Contributing author to the Electronics Packaging Handbook. Chapter 6, 2000. (CRC/IEEE Press).

This unique course is an all-inclusive tutorial that covers fundamentals of designing a product to meet EMC and signal integrity requirements. There are many areas of concern, not just for the printed circuit board but also at the system level.  In order for any product to operate within its intended operating environment without functional disruption along with regulatory compliance, we must design systems to stringent requirements without fully understanding how and whys things work.  This is because electromagnetic theory is considered to be complex and the math unbearable.  Without understanding field propagation in a transmission line, it becomes nearly impossible to achieve first time success especially with clock frequencies getting higher along with printed circuit boards radiating undesired EMI in a plastic enclosure that provides no shielding capabilities.
One must design and manufacture a product in a short period of time. Performing experiments using trial and error or locating and reading technical papers based on academic research takes up valuable time and provides minimal value to the working designer.  Engineers need to know electromagnetic theory in a simplified manner and implement design requirements quickly.  As operating frequencies increase, losses in transmission lines create both signal integrity and EMC problems. This course illustrates how to identify transmission line losses quickly along with mitigation solutions.
Course Objective
This course presents extensive knowledge on how RF energy is created within a printed circuit board and the manner of signal propagation using transmission line theory in both the time and frequency domains.  Implementing suppression design techniques is required to ensure functionality for signal integrity as well as complying with EMC requirements.  No matter how well one designs a printed circuit board, common-mode RF currents will still be created due to losses in transmission lines and will propagate somehow to other components or the environment
Upon completion, one should be able to design and test a system to meet both time domain (signal integrity) and EMC (frequency domain) quickly and at minimal cost.
Who Should Attend
This course targets engineers and technicians tasked to design a system or printed circuit board without formal training in multiple disciplines of engineering, or those who do not understand what Maxwell Equations tell us without the need to solve any mathematic equation.  It is extremely valuable for EMC specialist who must solve problems quickly and easily at low cost and is presented at the “fundamental level” which means advanced engineering theory is now easily understood by everyone.  Experienced engineers will also find extensive benefit as a refresher course on how to visualize electromagnetic field propagation on a printed circuit board.  
Benefits of Attending
    • Increased job knowledge by understanding electromagnetic theory in a simplified manner
    • Allows first-time compliance to EMC requirements related to design, testing and troubleshooting
    • Reduce design time, manufacturing costs and time spent at an EMC test lab
    • State-of-the-art design techniques presented for both printed circuit board and system level
    • Continuing education credit and making the attendees a much higher quality engineer at low cost

EMC Made Simple – Printed Circuit Board and System Design
(Two Day Version)

    • What is Signal Integrity and Design Concerns
    • Understanding Clock Signal Distortion
    • Aspects of High-Speed Signal Integrity Problems
    • Lossy and Lossless Transmission Lines  
    • Transmission Line System Operation
    • Reflections – Poor Signal Integrity
    • Crosstalk Between Transmission Lines
    • Component Characteristics at RF Frequencies
    • Spread Spectrum Clock Generation

    • Basic Aspects Releted to an EMC Event
    • Maxwell Made Simple
    • Right Hand Rule and Maxwell’s Equations
    • Electric and Magnetic Field Impedance  
    • Closed Loop Circuits (Ampere’s Law)
    • How Does Current Travel–What Path Does It Take?
    • Common-Mode and Differential-Mode Currents
    • Antenna Structures for Field Propagation
    • The Need for Flux Cancellation

    • Image Plane Theory
    • RF Current Return and Flux Cancellation
    • RF Current Density Distribution
    • Loop Area Between Circuit and Components  
    • Calculating RF Field Strengths
    • Ground Slots with Through-Hole Components
    • Functional Partitioning

    • Signal Spectra (Fourier Analysis)
    • Microstrip and StriplineTopologies
    • Impedance Control Equations
    • Capacitive Loading
    • Calculating Transmission Line Length for Critical Nets
    • Trace Routing and Clock Networks
    • Routing Differential and LVDS Signals
    • Layer Jumping
    • Routing Over a Split Plane-Single/Differential Signals

    • Power Distribution Network Overview
    • Requirements for Enhanced Power Distribution
    • Defining Capacitor Usage and Frequency Ranges
    • Commonly Used Dielectric Families
    • Capacitors Characteristic and Self-Resonance
    • Effects of Capacitors in Parallel
    • Power and Return Plane Capacitance
    • Power and/or Return Plane Bounce
    • Conflicting Rules Related to Decoupling Capacitors
    • Multi-Pole Decoupling Methodology
    • Effectiveness of Decoupling-Radius of Operation
    • The Capacitor Brigade
    • Decoupling Capacitors Causing Radiated EMI
    • Mounting Pad and Loop Inductance
    • Placement Recommendations  
    • Capacitor Mounting Concerns
    • Different Types of Capacitor Arrays
    • Buried Capacitance

    • Single and Double Sided Recommended Layout
    • Multi-Layer Stackup Assignments
    • Film and Manufacturing Concerns

    • Partitioning
    • Isolation (Moating), Bridging and Moat Violations
    • Digital and Analog Partitioning
    • Filtering and Grounding
    • Common- and Differential-Mode Currents on Cables
    • Multi-Point Grounding (I/O Connectors)
    • Audio and Video Circuits
    • Design Basics - Five Areas of Concern
    • Mechanicals and Interconnects
    • Signal Routing and Terminations

    • Different Types of Grounds Possible in a System
    • Common Ground Symbols
    • Different Types of Return Path Possibilities
    • Grounding Misconceptions
    • Product Safety and Signal Referencing Requirements
    • Dealing With Ground Currents  
    • Important Grounding Principles

    • Single/Multiple/Hybrid Topologies
    • Ground Trees

    • Inductance of Wire
    • Minimizing Ground Inductance
    • Mutual Inductance and Capacitance
    • Common Impedance Coupling
    • Ground Loop and Control Methodologies
    • Common-Mode Rejection
    • Avoiding Ground Loops

    • How ESD is Created
    • ESD Models and Triboelectric Series
    • Printed Circuit Board and System Level Techniques

    • Definition and the Need to Shield
    • Transmission Line Theory Related to Shielding  
    • Reflection, Absorption Loss and Skin Depth
    • Multiple Reflections in Thin Shields
    • Apertures in Shielding Walls  
    • Using Multiple Apertures and Degenerative Effects
    • Waveguide Below Cutoff
    • Printed Circuit Board Shielding Components
    • Shielded Cables- Types, Use and Implementation

    • The Need to Use Gaskets
    • Common Gasket Material, Properties and Performance
    • Mechanical Problems  
    • Electrochemical Grouping
    • Gasket Implementation
    • Conductive Coatings and Concerns
    • Effects of Shield Discontinuity
    • Slot Antenna Effects, Length Control and Joint Unevenness
    • Proper and Improper Shield Penetrations
    • The Need to Filter and Definitions
    • Different Types of Filter Configurations
    • Basic Filter Elements and Operational Characteristics
    • How to Select a Ferrite Filter Element
    • Installation Guidelines
    • Cable Shield Grounding Requirements/Implementation
    • Implementation a Cable Shield into an Assembly
    • Terminating a Cable Shield
    • Aspects to Consider When Specifying a Shielded Cable
    • Shielded Compartments  
    • Measuring Shielding Effectiveness and Seam Voltages
    • Summary – Grounding and Shielding

    • Localized Planes
    • Trace Routing for Corners
    • The 20-H Rule
    • Grounded Heatsinks
    • Electronic Bandgaps (EBG)  

to learn more Edadoc EMC design capability: http://www.en.edadoc.com/Capabilities/PCBDesign/EMCDesign