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How to Avoid EMC Problems in PCB Design
Electromagnetic Compatibility (EMC), Signal Integrity (SI), and Power Integrity (PI) are
closely related. We must maintain SI & PI performance and consider stack-up
& shield isolation in order to avoid EMC problems when laying out a PCB.
Source ：Edadoc 2018/7/3>>Detail
Switching vs. Linear Regulators
We will analyze the pros and cons of Switching regulators (DC-to-DC) and Linear regulators (LDO) in order to determine the best option for PCB Design.
Source ：Edadoc 2017/8/17>>Detail
Flexible Circuit Component Assembly and a Math Lesson.
The market for rigid PCBs is estimated to be about 10x the market size
for flexible printed circuits (FPCs). As a result, the equipment
infra-structure is driven primarily by the needs of the rigid board
market. This is true of both equip-ment used to fabricate the circuitry
(image, etch, copper plate, AOI, etc.) and equipment used for component
assembly (wave solder and SMT assembly).
Source ：Edadoc 2016/6/2>>Detail
Process Engineering: PCB Manufacturing’s “Delta Force”
The role of the process engineer is arguably one of the most important
jobs in the printed circuit industry. The process engineer is on the
front line of manufacturing and responsible for making sure product
yields and profitability meet expectations.
Source ：Edadoc 2016/5/12>>Detail
The Evolution of FR-4
In the past 40-plus years of PCB manufacturing, the primary material of
choice has overwhelmingly been e-glass supported FR-4 resin laminates.
This is due to the excellent dimensional stability and reasonably
acceptable thermal performance (based on glass transition temperature
[Tg] and decomposition temperature [Td]). In general, these materials
exhibit impressive performance and excellent cost for a wide range of
Source ：Edadoc 2016/5/6>>Detail
Why Copper is Ideal for Flexible Circuitry?
While copper may not rank the best in any one of the above criteria, it probably has the best overall rating.
Source ：Edadoc 2016/4/14>>Detail
Design for Test in the U.S. Market.
With most high-volume printed circuit assembly being sent outside the
United States, we have a unique challenge for testing the lower
volume/high turnover assemblies domestically. However, with a little
planning and the right contract manufacturer (CM), test does not need to
be an issue.
Source ：Edadoc 2016/4/7>>Detail
Why Do Different Test Methods Yield Different Electrical Values?
A variety of different test methods may be used for any one electrical
concern. This article will discuss the issues related to determining the
dielectric constant (Dk) and dissipation factor (Df or Tan-Delta).
Source ：Edadoc 2016/3/30>>Detail
3D Assembly Processes: A Look at Today and Tomorrow
Printed circuit board
assembly (PCBA), starting with the plated through-hole, later evolving
to surface mount assembly, have been planar in two dimensions.
Components are mounted onto the PCBA in the x and y direction, where the
height, z direction, is controlled by the component height.
Source ：Edadoc 2016/3/2>>Detail
How does the EDADOC PCBA factory work?
How does the EDADOC PCBA factory work with 12 SMT lines? Edadoc PCBA factory devoted to cooperate with our clients, thus offers great product experience to end customers.
Source ：Edadoc 2016/2/25>>Detail